quality Mogultech
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identifying any potential problems or concerns well in advance, before product ever reaches our customers.
Rigorous Quality Inspection Process
• Level 1: Visual Inspection
• Visual inspection and authenticity verification is conducted on all incoming materials by Mogultech inspectors. Visual inspection review includes:
• 1Manufacturer P/N, quantity, and date code verification
• 2Body marking inspection (faded marking, broken text, double print, ink stamps, etc.)
• 3Physical conditions inspection (lead bend, scratches, chipped edges, etc.)
• 4Taping condition inspection (dented packet, missing parts, etc.)
• 5Verify moisture barrier protection verification (vacuum sealed, humidity indicator with specification)
• 6Original factory sealed components vs. non-factory seal
• 7Any visual irregularities
• Level 2: Engineering Review
• Materials identified as questionable during the visual inspection process are reevaluated by Mogultech staff engineers. Product sampling plans are also employed to ensure product consistency. Engineering review includes:
• Review of level 1 findings
• 1Counterfeit databases referenced and updated
• 2Label verification (bar code and label review)
• 3Manufacturer logo and date log verification
• 4ERAI counterfeit alert program
• Level 3: Testing
• Product testing is completed to ensure that any questionable materials meet manufacturers' specifications. Product samples are also periodically tested to ensure product consistency and testing. Testing includes:
• 1Decapsulation test
• 2Solderability test
• 3Surface contamination analysis
Electronic Components Distribution - Testing
• To ensure the broadest, deepest and most dependable network of quality electronic components, Mogultech has developed a global network of third-party testing laboratories to provide expert product testing during quality assurance evaluations.
•
• Testing of products is completed by certified partner laboratories that work to ensure that materials identified as questionable meet manufacturers’ specifications and requirements. This global network provides Mogultech access to technical know-how and state-of-the-art technology, adding these core competencies to our distribution service offerings.
• In addition, electronic component product samples are randomly selected and tested periodically to ensure product consistency and vendor quality and confirm internal quality controls.
• Testing conducted includes:
– Decapsulation
– Solderability
– X-ray examination
– Contamination analysis
– DC & AC functionality
– Calibration and capacitance measurement
– Electrical
identifying any potential problems or concerns well in advance, before product ever reaches our customers.
Rigorous Quality Inspection Process
• Level 1: Visual Inspection
• Visual inspection and authenticity verification is conducted on all incoming materials by Mogultech inspectors. Visual inspection review includes:
• 1Manufacturer P/N, quantity, and date code verification
• 2Body marking inspection (faded marking, broken text, double print, ink stamps, etc.)
• 3Physical conditions inspection (lead bend, scratches, chipped edges, etc.)
• 4Taping condition inspection (dented packet, missing parts, etc.)
• 5Verify moisture barrier protection verification (vacuum sealed, humidity indicator with specification)
• 6Original factory sealed components vs. non-factory seal
• 7Any visual irregularities
• Level 2: Engineering Review
• Materials identified as questionable during the visual inspection process are reevaluated by Mogultech staff engineers. Product sampling plans are also employed to ensure product consistency. Engineering review includes:
• Review of level 1 findings
• 1Counterfeit databases referenced and updated
• 2Label verification (bar code and label review)
• 3Manufacturer logo and date log verification
• 4ERAI counterfeit alert program
• Level 3: Testing
• Product testing is completed to ensure that any questionable materials meet manufacturers' specifications. Product samples are also periodically tested to ensure product consistency and testing. Testing includes:
• 1Decapsulation test
• 2Solderability test
• 3Surface contamination analysis
Electronic Components Distribution - Testing
• To ensure the broadest, deepest and most dependable network of quality electronic components, Mogultech has developed a global network of third-party testing laboratories to provide expert product testing during quality assurance evaluations.
•
• Testing of products is completed by certified partner laboratories that work to ensure that materials identified as questionable meet manufacturers’ specifications and requirements. This global network provides Mogultech access to technical know-how and state-of-the-art technology, adding these core competencies to our distribution service offerings.
• In addition, electronic component product samples are randomly selected and tested periodically to ensure product consistency and vendor quality and confirm internal quality controls.
• Testing conducted includes:
– Decapsulation
– Solderability
– X-ray examination
– Contamination analysis
– DC & AC functionality
– Calibration and capacitance measurement
– Electrical
